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tlp284? 4 2009-06-05 1 toshiba photocoupler gaas ired & photo ?t ransistor tlp284 ? 4 programmable controllers ac/dc ? input module hybrid ics TLP284-4 consists of photo transistor, optically coupled to two gallium arsenide infrared emitting diode connected inverse parallel, and can operate directly by ac input current since TLP284-4 is guaranteed wide operat ing temperature (ta=-55 to 110 ? c) and high isolation voltage (3750vrms ), it?s suitable for high-density surface mounting applications such as programmable controllers and hybrid ics. ? collector ? emitter voltage : 80 v (min) ? current transfer ratio : 50% (min) rank gb :100% (min) ? isolation voltage : 3750 vrms (min) ? guaranteed performance over -55 to 110 ?c ? ul recognized : ul1577 , file no. e67349 ? cul recognized : csa component acceptance service no.5a ? bsi (under application) : bs en 60065: 2002, : bs en 60950-1: 2006 ? option (v4) vde approved en60747-5-2 maximum operating insulation voltage : 707 v pk highest permissible over voltage : 6000 v pk ( note ) when a en60747-5-2 approved type is needed, please designate the ?option(v4)? construction mechanical rating tlp 284 -4 toshiba 11-10f1 weight: 0.19 g (typ.) creepage distance clearance insulation thickness 5.0 mm (min) 5.0 mm (min) 0.4 mm (min) unit in mm pin configuration TLP284-4 9 8 10 7 11 6 12 5 13 4 14 3 15 2 16 1 : anode- cathode : cathode anode : emitter : collector 1,3,5,7 2,4,6,8 9,11,13,15 10,12,14,16
tlp284? 4 2009-06-05 2 current transfer ratio note1: ex. rank gb: TLP284-4 (gb) application type name for certification tes t, please use standard product type name, i.e. TLP284-4 (gb): TLP284-4 absolute maximum ratings (ta = 25c) characteristic symbol rating unit forward current i f(rms) 50 ma forward current derating i f /c ? 0.67 (ta 50c) ma /c pulse forward current (note2) i fp 1 a led junction temperature t j 125 c collector ? emitter voltage v ceo 80 v emitter ?collector voltage v eco 7 v collector current i c 50 ma collector power dissipation (1 circuit) p c 100 mw collector power dissipation derating (ta 25c) (1 circuit) p c /c ?1.0 mw /c detector junction temperature t j 125 c operating temperature range t opr ?55 to 110 c storage temperature range t stg ?55 to 125 c lead soldering temperature t sol 260 (10s) c total package power dissipation (1 circuit) p t 170 mw total package power dissipation derating (ta 25c) (1 circuit) p t /c ?1.7 mw /c isolation voltage (note3) bv s 3750 vrms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note2: pulse width 100 s, frequency 100hz note3: ac, 1 minute, r.h. 60%, device considered a two terminal device : led side pins shorted together and detector side pins shorted together. current transfer ratio (%) (i c / i f ) i f = 5 ma, v ce = 5 v, ta = 25 type classification (note1) min max marking of classification blank 50 600 blank , gb TLP284-4 rank gb 100 600 gb
tlp284? 4 2009-06-05 3 individual electrical char acteristics (ta = 25c) note.4: irradiation to marking side using standard light bulb. note 5: because of the construction, leak current might be increased by ambient light. please use photocoupler with less ambient light. coupled electrical characteristics (ta = 25c) characteristic symbol test condition min typ. max unit 50 ? 600 current transfer ratio i c / i f i f = 5 ma, v ce = 5 v rank gb 100 ? 600 % ? 60 ? saturated ctr i c / i f (sat) if = 1 ma, v ce = 0.4 v rank gb 30 ? ? % i c = 2.4 ma, i f = 8 ma ? ? 0.4 ? 0.2 ? collector ?emitter saturation voltage v ce (sat) i c = 0.2 ma, i f = 1 ma rank gb ? ? 0.4 v off ?state collector current i c(off) v f = 0.7 v, v ce = 48 v ? ? 10 a ctr symmetry i c (ratio) i c (i f = ? 5 ma) / i c (i f = 5 ma) (note 6) 0.33 ? 3 ? note 6: 5v) ce v, f1 i f (i c1 i 5v) ce v, f2 i f (i c2 i c(ratio) i = = = = = characteristic symbol test condition min typ max unit forward voltage v f i f = 10 ma 1.0 1.15 1.3 v led capacitance c t v = 0, f = 1 mhz D 60 ? pf collector ?emitter breakdown voltage v (br) ceo i c = 0.5 ma 80 D ? v emitter ? collector breakdown voltage v (br) eco i e = 0.1 ma 7 D ? v v ce = 48 v, ambient light below (100 ? x ) (note4) D 0.01 (2) 0.1 (10) a collector dark current (note 5) i ceo v ce = 48 v, ta = 85c ambient light below (100 ? x ) (note4) D 2 (4) 50 (50) a detector capacitance (collector to emitter) c ce v = 0, f = 1 mhz D 10 D pf v ce i c1 i c2 i f1 i f2
tlp284? 4 2009-06-05 4 isolation characteristics (ta = 25c) characteristic symbol test condition min typ. max unit capacitance input to output c s v s = 0v, f = 1 mhz ? 0.8 ? pf isolation resistance r s v s = 500 v, r.h. 60% 110 12 10 14 ? ? ac, 1 minute 3750 ? ? ac, 1 second, in oil ? 10000 ? v rms isolation voltage bv s dc, 1 minute, in oil ? 10000 ? v dc switching characteristics (ta = 25c) characteristic symbol test condition min typ. max unit rise time t r ? 2 ? fall time t f ? 3 ? turn ? on time t on ? 3 ? turn ? off time t off v cc = 10 v, i c = 2 ma r l = 100 ? ? 3 ? s turn ? on time t on ? 2 ? storage time t s ? 25 ? turn ? off time t off r l = 1.9 k ? (fig.1) v cc = 5 v, i f = 16 ma ? 40 ? s (fig. 1): switching time test circuit v ce v cc r l i f i f v ce v cc 0.5v 4.5v t off t on t s
tlp284? 4 2009-06-05 5 i f -ta p c -ta allowable forward current i f (ma) 0 20 40 60 80 100 -20 0 20 40 60 80 100 120 allowable collector power dissipation p c (mw) ) 0 20 40 60 80 100 120 140 160 180 200 -20 0 20 40 60 80 100 120 ambient temperature ta ( ? c) ambient temperature ta ( ? c) i fp -d r i f -v f pulse forward current i fp (ma) forward current i f (ma) 0.1 1 10 100 0.6 0.8 1 1.2 1.4 1.6 duty cycle ratio d r forward voltage v f (v) ? v f / ? ta - i f i fp ? v fp forward voltage temperature coefficient v f / ta ( mv/ ) pulse forward current i fp (ma) 1 10 100 1000 0.6 1 1.4 1.8 2.2 2.6 3 forward current i f (ma) pulse forward voltage v fp (v) *the above graphs show typical characteristic. 100?c 75?c 50?c 25?c 0?c -25?c -50?c 10 30 50 100 1000 300 500 3000 10 -3 10 -2 10 -1 10 0 -3.2 -2.8 -2.4 -2 -1.6 -1.2 -0.8 -0.4 0.1 1 10 50 5 0.5 pulse width Q 10 s repetitive frequency=100hz ta =25 pulse width Q100 s ta =25 ? c
tlp284? 4 2009-06-05 6 i c -v ce i c -v ce collector current i c (ma) 0 10 20 30 40 50 0510 collector current i c (ma) 0 5 10 15 20 25 30 00.51 collector-emitter voltage v ce (v) collector-emitter voltage v ce (v) i c -i f i ceo -ta collector current i c (ma) 0.1 1 10 100 0.1 1 10 100 collector dark current i d (i ceo ) ( a) 0 20406080100120 forward current i f (ma) ambient temperature ta ( ? c) i c/ i f -i f current transfer ratio i c / i f (%) 10 100 1000 0.1 1 10 100 forward current i f (ma) *the above graphs show typical characteristic. 5 10 50 30 20 15 ta =25 ? c sample a sample b v ce =10v v ce =5v v ce =0.4v sample a sample b v ce =10v v ce =5v v ce =0.4v 10 1 10 0 10 - 1 10 - 2 10 - 3 10 - 4 24v 10v 5v v ce =48v i f =2ma i f =5ma 10 15 20 30 50 p c (max) ta =25 ? c
tlp284? 4 2009-06-05 7 v ce(sat) - ta i c - ta collector-emitter saturation voltage v ce(sat) (v) 0 0.04 0.08 0.12 0.16 0.2 0.24 0.28 -40 -20 0 20 40 60 80 100 120 collector current i c (ma) 0.01 0.1 1 10 100 -40 -20 0 20 40 60 80 100 120 ambient temperature ta ( ? c) ambient temperature ta ( ? c) switching time - r l switching time - ta switching time ( s) 1 10 100 1000 1 10 100 switching time ( s) 0.1 1 10 100 -60 -40 -20 0 20 40 60 80 100 120 load resistance r l (k ? ) ambient temperature ta ( ? c) *the above graphs show typical characteristic. i f =8ma, ic=2.4ma i f =1ma, ic=0.2ma v ce =5v i f =0.5m a 5 1 10 25 t off ta =25 ? c i f =16ma v cc =5v i f =16ma v cc =5v r l =1.9k ? t s t on t off t s t on
tlp284? 4 2009-06-05 8 soldering and storage 1. soldering 1.1 soldering when using a soldering iron or medium infrared ray/ho t air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) using solder reflow temperature profile example of lead (pb) solder temperature profile example of using lead (pb)-free solder 2) using solder flow (for lead (pb) solder, or lead (pb)-free solder) ? please preheat it at 150c between 60 and 120 seconds. ? complete soldering within 10 seconds below 260c. each pin may be heated at most once. 3) using a soldering iron complete soldering within 10 seconds below 260c, or within 3 seconds at 350c. each pin may be heated at most once. time (s) (c) 240 210 160 60 to 120s less than 30s package surface temperature 140 time (s) (c) 260 230 190 60 to 120s 30 to 50s 180 package surface temperature this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
tlp284? 4 2009-06-05 9 2. storage 1) avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) follow the precautions printed on the packing label of the device for transportation and storage. 3) keep the storage location temperature and humidity within a range of 5c to 35c and 45% to 75%, respectively. 4) do not store the products in locations with poiso nous gases (especially corrosive gases) or in dusty conditions. 5) store the products in locations with minimal temperature fluctuations. rapi d temperature changes during storage can cause condensation, resu lting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) when restoring devices after removal from their packing, use an ti-static containers. 7) do not allow loads to be applied direct ly to devices while they are in storage. 8) if devices have been stored for more than two year s under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use.
tlp284? 4 2009-06-05 10 option:specification for embossed-tape packing (tp) for mini-flat coupler 1. applicable package package name product type sop16 mini-flat coupler 2. product naming system type of package used for shipment is denoted by a symbol suffix after a produc t number. the method of classification is as below. example ????? [[g]]/rohs compatible (note7) tape type ctr rank device name 3. tape dimensions 3.1 orientation of device in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure1 device orientation 3.2 tape packing quantity 2500 devices per reel 3.3 empty device recesses are as shown in table 1. table1 empty device recesses standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 device (max.) per reel not including leader and trailer 3.4 start and end of tape the start of the tape has 50 or more empty holes. th e end of tape has 50 or more empty holes and two empty turns only for a cover tape. tape feed tlp284 4
tlp284? 4 2009-06-05 11 3.5 tape specification (1) tape material: plastic (protection against electrostatics) (2) dimensions: the tape dimensions are as shown in figure 2 and table 2. figure2 tape forms table2 tape dimensions unit: mm unless otherwise specified: 0.1 symbol dimension remark a 7.5 D b 10.5 D d 7.5 center line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 12.0 cumulative error (max.) per 10 feed holes g 4.0 cumulative error (max.) per 10 feed holes k 0 2.2 internal space +0.1 -0.3 +0.1 -0.3 0.3 0.05 2.4 0.2 k 0 f 1.5 0.1 e d b 16.0 0.3 1.5 +0.1 ?0 a g 2.0 0.1
tlp284? 4 2009-06-05 12 3.6 reel material: plastic dimensions: the reel dimensions are as shown in figure 3 and table 3. figure 3 reel forms 4. packing either one reel or five reels of photoc ouplers are packed in a shipping carton. 5. label indication the carton bears a label indicating the product num ber, the symbol representing classification of standard, the quantity, the lot num ber and the toshiba company name. 6. ordering method when placing an order, please spec ify the product number, the ctr rank , the tape type and the quantity as shown in the following example. example TLP284-4(gb-tp,f) 2500 pcs quantity (must be a multiple of 2500) [[g]]/rohs compatible (note7) tape type ctr rank device name note7 : please contact your toshiba sales representative fo r details as to environmental matters such as the rohs compatibility of product. the rohs is the directive 2002/95/ec of the europe an parliament and of the council of 27 january 2003 on the restriction of the use of ce rtain hazardous substances in electrical and electronics equipment. symbol dimension a 330 2 b 80 1 c 13 0.5 e 2.0 0.5 u 4.0 0.5 w1 17.5 0.5 w2 21.5 1.0 e w1 w2 a b c u table 3 reel dimensions unit: mm
tlp284? 4 2009-06-05 13 toshiba photocoupler option:(v4) attachment : specifications for en60747-5-2 option: (v4) types : TLP284-4 type designations for ?option: (v4) ?, which are tested under en60747 requirements. ex.: TLP284-4 (v4gb-tp,f v4 : en60747 option gb : ctr rank type tp : standard tape & reel type f : [[g]]/rohs compatible (note7) note: use toshiba standard type numb er for safety standard application. ex.: TLP284-4 (v4gb-tp,f TLP284-4 en60747 isolation characteristics description symbol rating unit application classification for rated mains voltage 150vrms for rated mains voltage 300vrms i-iv i-iii D climatic classification 55 / 110 / 21 D pollution degree 2 D maximum operating insulation voltage v iorm 707 vpk input to output test voltage, method a vpr=1.5 v iorm , type and sample test tp=10s, partial discharge<5pc v pr 1060 vpk input to output test voltage, method b vpr=1.875 v iorm , 100% production test tp=1s, partial discharge<5pc v pr 1325 vpk highest permissible overvoltage (transient overvoltage, tpr=60s v tr 6000 vpk safety limiting values (max. permissible rating s in case of fault, also refer to thermal derating curve) current (input current i f , psi=0) power (output or total power dissipation) temperature i si p si t si 250 400 150 ma mw insulation resistance v io =500v, ta=t si r si 10 9 ?
tlp284? 4 2009-06-05 14 insulation related specifications minimum creepage distance cr 5.0mm minimum clearance cl 5.0mm minimum insulation thickness ti 0.4mm comparative tracking index ctl 175 1. if a printed circuit is incorporated, the creepage di stance and clearance may be reduced below this value. (e.g. at a standard distance betwe en soldering eye centers of 3.5mm). if this is not permissible, the user shall take suitable measures. 2. this photocoupler is suitable for ?safe electric al isolation? only within the safety limit data. maintenance of the safety data shall be ensured by means of protective circuit. vde test sign marking on product for en60747 marking on packing for en60747 marking example TLP284-4(f) v d e 1pin indication ctr rank marking lot no. type name mark for option (v4)) tlp284 4 v
tlp284? 4 2009-06-05 15 figure 1 partial discharge measurement procedure according to en60747 destructive test for qualification and sampling tests. method a (for type and sampling tests, destructive tests) t 1 , t 2 t 3 , t 4 t p (measuring time for partial discharge) t b t ini v v initial (6kv) v pr (1060v) v iorm (707v) 0 t 1 t ini t 3 t 2 t p t b t 4 t = 1 to 10 s = 1 s = 10 s = 12 s = 60 s t p v pr (1325v ) v iorm (707v ) v t t 3 t 4 t b figure 2 partial discharge measurement procedure according to en60747 non-destructive test for100% inspection. method b (for sample test,non- destructive test) t 3 , t 4 t p (measuring time for partial discharge) t b = 0.1 s = 1 s = 1.2 s figure 3 dependency of maximum safety ratings on ambient temperature 500 400 300 200 100 0 0 25 50 75 100 125 150 175 500 400 300 200 100 0 ta (c) psi isi isi (ma) psi ( mw )
tlp284? 4 2009-06-05 16 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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